Electro-Optics Package
This product was developed under our client’s Phase II SBIR grant from the U.S. Navy. PPI’s tasks included high density PCB and mechanical packaging for a dense electro-optical system which features our client’s proprietary embedded data acquisition and signal processing electronics.
Challenges included dense electro-optical packaging, thermal management, Mil-1671 vibration and Mil-901 shock hardening.
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